<![CDATA[Terminal finish on the MCA1101-5-5]]>Due to the risk of tin-whisker growth, we need some information about the pure-tin plating applied to the leads of the MCA1101-5-5:

  1. Pb content - What is the percentage by weight of lead (Pb) that is present as an alloying
    element with the tin finish?
    <0.2
    0.2-1.0
    1.1-2.0
    2.1-2.9

  2. What is the final finish after deposition?
    Bright
    Matte

  3. What is the thickness of the tin deposit in micro-inches?
    <50 (< 0.000 050")
    50-250
    251-500
    501-1000

1000

  1. What material is directly under the tin?
    Brass/Bronze
    Copper
    Low-expansion alloy
    Nickel
    Other __________________

  2. What is the substrate that controls the Coefficient of Thermal Expansion?
    Ceramic
    Low-Expansion Alloy
    Copper or Aluminum
    Ferrous
    Other _________________

  3. Is the plating treated after deposition?
    Annealed
    Fused
    No heating after deposition

This data helps us assess and quantify the risk of tin whisker growth from the terminals
of the part. Thank you for your help with this!

]]>https://forum.aceinna.com//topic/365/terminal-finish-on-the-mca1101-5-5RSS for NodeMon, 13 Jul 2026 07:10:42 GMTMon, 14 Nov 2022 14:12:00 GMT60<![CDATA[Reply to Terminal finish on the MCA1101-5-5 on Mon, 14 Nov 2022 14:12:00 GMT]]>Due to the risk of tin-whisker growth, we need some information about the pure-tin plating applied to the leads of the MCA1101-5-5:

  1. Pb content - What is the percentage by weight of lead (Pb) that is present as an alloying
    element with the tin finish?
    <0.2
    0.2-1.0
    1.1-2.0
    2.1-2.9

  2. What is the final finish after deposition?
    Bright
    Matte

  3. What is the thickness of the tin deposit in micro-inches?
    <50 (< 0.000 050")
    50-250
    251-500
    501-1000

1000

  1. What material is directly under the tin?
    Brass/Bronze
    Copper
    Low-expansion alloy
    Nickel
    Other __________________

  2. What is the substrate that controls the Coefficient of Thermal Expansion?
    Ceramic
    Low-Expansion Alloy
    Copper or Aluminum
    Ferrous
    Other _________________

  3. Is the plating treated after deposition?
    Annealed
    Fused
    No heating after deposition

This data helps us assess and quantify the risk of tin whisker growth from the terminals
of the part. Thank you for your help with this!

]]>https://forum.aceinna.com//post/1484https://forum.aceinna.com//post/1484Mon, 14 Nov 2022 14:12:00 GMT