Due to the risk of tin-whisker growth, we need some information about the pure-tin plating applied to the leads of the MCA1101-5-5:
Pb content - What is the percentage by weight of lead (Pb) that is present as an alloying
element with the tin finish?
What is the final finish after deposition?
What is the thickness of the tin deposit in micro-inches?
<50 (< 0.000 050")
What material is directly under the tin?
What is the substrate that controls the Coefficient of Thermal Expansion?
Copper or Aluminum
Is the plating treated after deposition?
No heating after deposition
This data helps us assess and quantify the risk of tin whisker growth from the terminals
of the part. Thank you for your help with this!