Due to the risk of tin-whisker growth, we need some information about the pure-tin plating applied to the leads of the MCA1101-5-5:
-
Pb content - What is the percentage by weight of lead (Pb) that is present as an alloying
element with the tin finish?
<0.2
0.2-1.0
1.1-2.0
2.1-2.9 -
What is the final finish after deposition?
Bright
Matte -
What is the thickness of the tin deposit in micro-inches?
<50 (< 0.000 050")
50-250
251-500
501-1000
1000
-
What material is directly under the tin?
Brass/Bronze
Copper
Low-expansion alloy
Nickel
Other __________________ -
What is the substrate that controls the Coefficient of Thermal Expansion?
Ceramic
Low-Expansion Alloy
Copper or Aluminum
Ferrous
Other _________________ -
Is the plating treated after deposition?
Annealed
Fused
No heating after deposition
This data helps us assess and quantify the risk of tin whisker growth from the terminals
of the part. Thank you for your help with this!